12V9 150*20*31.75*10mm D30 C125 Roda berlian ikatan resin

Roda Penggiling Berlian Ikatan Resin
April 18, 2025
Koneksi Kategori: Resin Grinding Wheel
Singkat: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
Fitur Produk Terkait:
  • 12V9 cup wheel shape for precision grinding applications.
  • 150mm outer diameter (D) and 20mm thickness (T) for versatile use.
  • 31.75mm inner hole diameter (H) ensures compatibility with standard machines.
  • 10mm abrasive width (W) for precise material removal.
  • Butiran abrasif berlian D30 (G) memberikan kekerasan dan ketahanan aus yang sangat tinggi.
  • C125 diamond concentration (C) for optimal performance.
  • Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
  • Ukuran yang dapat disesuaikan tersedia untuk memenuhi persyaratan tertentu.
Pertanyaan Umum:
  • Bahan apa yang bisa diproses 12V9 Resin Bond Diamond Grinding Wheel?
    Roda penggiling ini sangat ideal untuk mengolah alat karbida, komponen keramik, dan bahan semikonduktor.
  • What machine tools are compatible with this grinding wheel?
    It is suitable for use with tool grinders and cylindrical grinders.
  • Can the grinding wheel be customized to different sizes?
    Yes, we offer customization for other sizes based on your specific requirements.