Singkat: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
Fitur Produk Terkait:
12V9 cup wheel shape for precision grinding applications.
150mm outer diameter (D) and 20mm thickness (T) for versatile use.
31.75mm inner hole diameter (H) ensures compatibility with standard machines.
10mm abrasive width (W) for precise material removal.
Butiran abrasif berlian D30 (G) memberikan kekerasan dan ketahanan aus yang sangat tinggi.
C125 diamond concentration (C) for optimal performance.
Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
Ukuran yang dapat disesuaikan tersedia untuk memenuhi persyaratan tertentu.
Pertanyaan Umum:
Bahan apa yang bisa diproses 12V9 Resin Bond Diamond Grinding Wheel?
Roda penggiling ini sangat ideal untuk mengolah alat karbida, komponen keramik, dan bahan semikonduktor.
What machine tools are compatible with this grinding wheel?
It is suitable for use with tool grinders and cylindrical grinders.
Can the grinding wheel be customized to different sizes?
Yes, we offer customization for other sizes based on your specific requirements.